Please contact the conference secretariat here for group registration. The deadline for abstract submission is march 20th 2020. Institute of electrical and electronics engineers ieee. Authorized distributor of all ieee proceedings toc. Techniques on thermal management of nextgeneration power electronics. International conference on electronic packaging technology, 2005. Researchers around the world are welcome to contribute and attend.
Substrates and interposers laminates, interposers, fine pitch, buildup substrates, flexible printed circuits, embedded, conductive paste, thin core, coreless, low cte 3. December 11, 20 singapore eptc 20 will feature technical sessions, short coursesforums, an exhibition, social and networking activities. Icept stands for international conference on electronic packaging technology. Advanced packaging and thermal management of highpower dcdc. Ultrathin and highdensity packaging using both sides flip chip technology kazuto nishida, kazumichi. The national museum of emerging science and innovation, tokyo. Ieee high density packaging icepthdp shanghai, china 2011. Iwlpc brings together some of the semiconductor industrys most respected authorities addressing all aspects of waferlevel, 3d, tsv, and mems device packaging and manufacturing. How is international symposium on electronic packaging technology abbreviated. Electronics packaging technology conference eptc 2015. The sixteenth international conference on electronic. Iwlpc international wafer level packaging conference. International journal of materials and product technology.
Conference publication, document, internet resource. Conference on electrical performance of electronic packaging and. International microsystems, packaging, assembly and circuits technology conference in 2016, explore presented research, speakers and authors of impact 2016. Icept international conference on electronic packaging. Shanghai, china 811 august 2018 ieee catalog number. The 15th electronics packaging technology conference eptc 20 is an international event organized by the ieee reliabilitycpmted singapore chapter and sponsored by ieee cpmt society. The electronic components and technology conference ectc is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. Institute of electrical and electronics engineers ieee pod publ. Ectc is sponsored by the ieee electronics packaging society. Advanced packaging and thermal management of highpower. Electronic packaging and interconnection techniques, education at university levela romanian experience.
Icept is defined as international conference on electronic packaging technology somewhat frequently. Volumes international electronic packaging technical conference. For a pdf version of the call for papers, please click here. Icept 2020 2020 21st international conference on electronic. Emergency preparedness technology center japan eptc.
The 6 th annual international conference on sensors and electronic instrumentation advances seia 2020 is a forum for presentation, discussion, and exchange of information and latest research and development results in both theoretical and experimental research in sensors, transducers and their related fields. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in highspeed designs. Electronic packaging technology conference how is electronic packaging technology conference abbreviated. Controlling the solder joint reliability of ewlb packages. Cfp18553pod 9781538663875 2018 19th international conference on electronic packaging. International conference on sustainable energy engineering and. Eptc 2015 will be held at marina mandarin hotel, located in vicinity of. An experimental investigation on the fluid distribution in a. Asme 2019 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems. Cicmt 2020, part of the technology crossover extravaganza. Hitec 2021 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. The 37th international electronics manufacturing technology. International conference on mechanical and electrical technology, 3rd, icmetchina 2011, volumes packagetoboard interconnection essentials of electronic packaging.
Eptc 2016 registration click here for individual registration special rate apply for the pdc group registration. Ieee high density packaging icepthdp shanghai, china. How is international conference on electronic packaging technology abbreviated. The 17th electronics packaging technology conference eptc 2015 is an international event organized by the ieee reliabilitycpmted singapore chapter and sponsored by ieee cpmt society. An experimental investigation on the fluid distribution in. International microsystems, packaging, assembly and circuits. It is an international event organized by the ieee cpmt malaysia chapter with co.
Proceedings, 2014 15th international conference on electronic packaging technology available from some providers with title. Electronics packaging technology conference eptc 2015 3d. Evolution of the microstructure of lead free solders. International conference on sensors and electronic. The international conference on integrated power electronics systems cips is biennially held in the city of nuremberg, germany. Fundamentals of packaging technology seminar course outline. Proceedings, 2010 international conference on electronic. The icepthdp 2012 is organized by electronic manufacturing and packaging technology society empt of chinese institute of electronics cie and coorganized by guilin. International conference on oxide materials for electronic engineering fabrication, properties and application. Ieee electronics packaging society, ieee microwave theory and techniques society. Proceedings of the asme 2019 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems.
Siitme ieee international symposium for design and. The historical evolution of packaging and packaging materials the industrial revolution and packaging growth of modern packaging roles the modern packaging industry 12 package development process management of the packaging function project scope and objectives the package development process the package design. On august 1114, the sixteenth international conference on electronic packaging technologyicept2015, sponsored by the chinese institute of electronics and ieeecpmt and undertaken by chinese electronic manufacturing and packaging technology branch of institute of electronics and csu the national key laboratory for high performance complex manufacturing was. International conference on electronics packaging technologies. The organising committee of siitme 2020 kindly invites you to submit an abstractpaper to the 2020 ieee 26th international symposium for design and technology in electronic packaging siitme.
Eptc 20 will feature technical sessions, short coursesforums, an exhibition, social and networking activities. Hitec 2020, part of the technology crossover extravaganza. Electronic packaging technology icept, 2014 15th international conference on note ieee catalog number. Proceedings, 2008 international conference on electronic. Conference on electrical performance of electronic packaging. Technology crossover hitec international microelectronics. Nov 11, 20 december 11, 20 singapore eptc 20 will feature technical sessions, short coursesforums, an exhibition, social and networking activities. Proceedings of a meeting held 1417 august 2007, shanghai, china. Asme 2019 international technical conference and exhibition on packaging and. Seminar fundamentals of packaging technology seminar for details and registration. International symposium on signal, image processing and pattern recognition.
Cfp16553pod 97815090975 2016 17th international conference on electronic packaging technology. International microsystems, packaging, assembly and. The conference has its origin in the power electronics specialists conference pesc and first took place in 2000. Epeps is the premier international conference on advanced and emerging issues in electrical modeling, analysis, synthesis and design of electronic interconnections, packages and systems. Asme 2017 15th international conference on fuel cell science, engineering and technology collocated with the asme 2017 power conference joint with icope17, the asme 2017 11th international conference on energy sustainability, and the asme 2017 nuclear forum.
Under the organizational sponsorship of the international microelectronics assembly and packaging society, hitec 2021 will be the forum for presenting leading. Epeps is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. International conference on future computer and communication, 3rd icfcc 2011 from identification to budget allocation. On august 1114, the sixteenth international conference on electronic packaging technology icept2015, sponsored by the chinese institute of electronics and ieeecpmt and undertaken by chinese electronic manufacturing and packaging technology branch of institute of electronics and csu the national key laboratory for high performance complex manufacturing was held in changsha. The 3 rd conference room in jiasuo, tsinghua university time topic instructors. Since 2004, conference papers are available through ieee xplore. Originally published in the 17th international conference on electronic packaging technology. Uncategorized electronics packaging technology conference. The scientific and technical event event will take place in pitesti, romania on october 21st24th, 2020.
Proceedings of a meeting held 1619 august 2017, harbin, china. Isept international symposium on electronic packaging. It aims to provide a good coverage of technological developments in all areas of electronic packaging from design to. An emerging trend in electronic packaging technology is the convergent syste m or a system that is characte rized by the integration of diverse product functions into one package or product. This international conference is organized by kmeps the korean microelectronics and packaging society, and will address comprehensive coverage of recent advances in materials, processing, simulation, printed electronics, nanomicro joining technology. A novel it risk management model for iterative agile projects international conference on software technology and engineering, 3rd icste 2011. This heterogeneous integration roadmap will continue the itrs heterogeneous integration and assembly and packaging roadmapping workshops held in previous years at estc and other cpmt conferences, while expanding the vision to address the major changes in the market place, and the disruptive changes in technology and the industry. Wafer level packaging fan infan out, embedded chip packaging, 2. Eptc 2015 will be held at marina mandarin hotel, located in vicinity of suntec city, singapore from 2nd,3rd and 4th december 2015. Isept stands for international symposium on electronic packaging technology. It aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. The iwlpc technical committee would like to invite you to submit an. Electronic packaging technology conference listed as eptc. Isept is defined as international symposium on electronic packaging technology rarely.
Icept 2020 21st international conference on electronic. International conference on integrated power electronics. Ijmpt is a refereed and authoritative publication which provides a forum for the exchange of information and ideas between materials academics and engineers working in university research departments and research institutes, and manufacturing, marketing and process managers, designers, technologists and research and development engineers working in industry. Pdf electronic packaging and interconnection techniques. Ectc ieee electronic components and technology conference. The ieee electronics packaging society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing. Advanced packaging wafer level packaging, system integration, pop, mcm, system on package, novel assembly technologies 2. Registration electronics packaging technology conference. The 37th international electronics manufacturing technology 18th electronics materials and packaging conference g hotel, georgetown, penang. Advanced flip chip package on package technology for mobile. Zhongguo dian zi xue hui china electronic packaging society qing hua da xue beijing, china. Conference on electrical performance of electronic. Epeps is the premier international conference on advanced and emerging issues in electrical.
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