Asme 2019 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems. Please contact the conference secretariat here for group registration. Isept stands for international symposium on electronic packaging technology. Technology crossover hitec international microelectronics. Ectc ieee electronic components and technology conference. Icept international conference on electronic packaging. Advanced packaging and thermal management of highpower dcdc. Volumes international electronic packaging technical conference. Advanced packaging and thermal management of highpower. Epeps is the premier international conference on advanced and emerging issues in electrical modeling, analysis, synthesis and design of electronic interconnections, packages and systems.
Proceedings, 2008 international conference on electronic packaging. Substrates and interposers laminates, interposers, fine pitch, buildup substrates, flexible printed circuits, embedded, conductive paste, thin core, coreless, low cte 3. Since 2004, conference papers are available through ieee xplore. International conference on sustainable energy engineering and. Advanced flip chip package on package technology for mobile. Authorized distributor of all ieee proceedings toc.
December 11, 20 singapore eptc 20 will feature technical sessions, short coursesforums, an exhibition, social and networking activities. Advanced packaging wafer level packaging, system integration, pop, mcm, system on package, novel assembly technologies 2. Proceedings of a meeting held 1619 august 2017, harbin, china. The national museum of emerging science and innovation, tokyo. Isept is defined as international symposium on electronic packaging technology rarely. Nov 11, 20 december 11, 20 singapore eptc 20 will feature technical sessions, short coursesforums, an exhibition, social and networking activities. Icept 2020 2020 21st international conference on electronic. Iwlpc international wafer level packaging conference. International journal of materials and product technology. Institute of electrical and electronics engineers ieee. Conference on electrical performance of electronic packaging and. Proceedings of the asme 2019 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems. It is an international event organized by the ieee cpmt malaysia chapter with co.
Ectc is sponsored by the ieee electronics packaging society. The organising committee of siitme 2020 kindly invites you to submit an abstractpaper to the 2020 ieee 26th international symposium for design and technology in electronic packaging siitme. Eptc 20 will feature technical sessions, short coursesforums, an exhibition, social and networking activities. International conference on electronic packaging technology, 2005. Electronic packaging technology icept, 2014 15th international conference on note ieee catalog number. Conference on electrical performance of electronic packaging. International symposium on signal, image processing and pattern recognition.
The deadline for abstract submission is march 20th 2020. Cfp18553pod 9781538663875 2018 19th international conference on electronic packaging. Cfp16553pod 97815090975 2016 17th international conference on electronic packaging technology. The 15th electronics packaging technology conference eptc 20 is an international event organized by the ieee reliabilitycpmted singapore chapter and sponsored by ieee cpmt society. Zhongguo dian zi xue hui china electronic packaging society qing hua da xue beijing, china. A novel it risk management model for iterative agile projects international conference on software technology and engineering, 3rd icste 2011.
Pdf electronic packaging and interconnection techniques. Emergency preparedness technology center japan eptc. Electronics packaging technology conference eptc 2015. International microsystems, packaging, assembly and circuits. International conference on future computer and communication, 3rd icfcc 2011 from identification to budget allocation. Originally published in the 17th international conference on electronic packaging technology. Isept international symposium on electronic packaging. The historical evolution of packaging and packaging materials the industrial revolution and packaging growth of modern packaging roles the modern packaging industry 12 package development process management of the packaging function project scope and objectives the package development process the package design. Under the organizational sponsorship of the international microelectronics assembly and packaging society, hitec 2021 will be the forum for presenting leading.
It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in highspeed designs. Shanghai, china 811 august 2018 ieee catalog number. International conference on mechanical and electrical technology, 3rd, icmetchina 2011, volumes packagetoboard interconnection essentials of electronic packaging. Hitec 2020, part of the technology crossover extravaganza. It aims to provide a good coverage of technological developments in all areas of electronic packaging from design to. The 3 rd conference room in jiasuo, tsinghua university time topic instructors. Asme 2017 15th international conference on fuel cell science, engineering and technology collocated with the asme 2017 power conference joint with icope17, the asme 2017 11th international conference on energy sustainability, and the asme 2017 nuclear forum. An emerging trend in electronic packaging technology is the convergent syste m or a system that is characte rized by the integration of diverse product functions into one package or product. Ieee electronics packaging society, ieee microwave theory and techniques society. International microsystems, packaging, assembly and circuits technology conference in 2016, explore presented research, speakers and authors of impact 2016. Electronics packaging technology conference eptc 2015 3d. Epeps is the premier international conference on advanced and emerging issues in electrical. The electronic components and technology conference ectc is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. Siitme ieee international symposium for design and.
How is international symposium on electronic packaging technology abbreviated. Techniques on thermal management of nextgeneration power electronics. Fundamentals of packaging technology seminar course outline. International microsystems, packaging, assembly and. Conference on electrical performance of electronic.
Ieee high density packaging icepthdp shanghai, china. Ultrathin and highdensity packaging using both sides flip chip technology kazuto nishida, kazumichi. Cicmt 2020, part of the technology crossover extravaganza. Epeps is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. Proceedings of a meeting held 1417 august 2007, shanghai, china. This heterogeneous integration roadmap will continue the itrs heterogeneous integration and assembly and packaging roadmapping workshops held in previous years at estc and other cpmt conferences, while expanding the vision to address the major changes in the market place, and the disruptive changes in technology and the industry. Proceedings, 2010 international conference on electronic. Icept stands for international conference on electronic packaging technology. Electronic packaging and interconnection techniques, education at university levela romanian experience.
The 37th international electronics manufacturing technology. An experimental investigation on the fluid distribution in. The sixteenth international conference on electronic. International conference on electronics packaging technologies. Uncategorized electronics packaging technology conference. This international conference is organized by kmeps the korean microelectronics and packaging society, and will address comprehensive coverage of recent advances in materials, processing, simulation, printed electronics, nanomicro joining technology. Eptc 2015 will be held at marina mandarin hotel, located in vicinity of. On august 1114, the sixteenth international conference on electronic packaging technology icept2015, sponsored by the chinese institute of electronics and ieeecpmt and undertaken by chinese electronic manufacturing and packaging technology branch of institute of electronics and csu the national key laboratory for high performance complex manufacturing was held in changsha. Icept 2020 21st international conference on electronic.
Proceedings, 2008 international conference on electronic. The international conference on integrated power electronics systems cips is biennially held in the city of nuremberg, germany. Seminar fundamentals of packaging technology seminar for details and registration. International conference on sensors and electronic. The icepthdp 2012 is organized by electronic manufacturing and packaging technology society empt of chinese institute of electronics cie and coorganized by guilin. Proceedings, 2014 15th international conference on electronic packaging technology available from some providers with title. It aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. Electronic packaging technology conference how is electronic packaging technology conference abbreviated. Electronic packaging technology conference listed as eptc. Iwlpc brings together some of the semiconductor industrys most respected authorities addressing all aspects of waferlevel, 3d, tsv, and mems device packaging and manufacturing. For a pdf version of the call for papers, please click here. The scientific and technical event event will take place in pitesti, romania on october 21st24th, 2020. The 6 th annual international conference on sensors and electronic instrumentation advances seia 2020 is a forum for presentation, discussion, and exchange of information and latest research and development results in both theoretical and experimental research in sensors, transducers and their related fields. Eptc 2016 registration click here for individual registration special rate apply for the pdc group registration.
International conference on oxide materials for electronic engineering fabrication, properties and application. The iwlpc technical committee would like to invite you to submit an. Hitec 2021 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. The 17th electronics packaging technology conference eptc 2015 is an international event organized by the ieee reliabilitycpmted singapore chapter and sponsored by ieee cpmt society. Ijmpt is a refereed and authoritative publication which provides a forum for the exchange of information and ideas between materials academics and engineers working in university research departments and research institutes, and manufacturing, marketing and process managers, designers, technologists and research and development engineers working in industry.
Registration electronics packaging technology conference. Conference publication, document, internet resource. Controlling the solder joint reliability of ewlb packages. The ieee electronics packaging society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing. An experimental investigation on the fluid distribution in a. Researchers around the world are welcome to contribute and attend. Ieee high density packaging icepthdp shanghai, china 2011. How is international conference on electronic packaging technology abbreviated.
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